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友阳光电

友阳光电

友阳光电

友阳光电

友阳光电

友阳光电

友阳光电

友阳光电

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Y5040020005 1550nm Narrow linewidth DFB Laser Diode Butterfly Module Specification

Y5040020005 1550nm Narrow linewidth DFB Laser Diode Butterfly Module Specification

所属分类: DFB

特点:窄谱线宽度<100KHz,边发射DFB激光器,波长为1550nm

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PN: Y5040020005

1550 nm Narrow linewidth Laser Diode Butterfly(14PIN) Module Specification

Features

  • Narrow Spectral Linewidth<100Khz, Edge-Emitting DFB for 1550 nm wavelength.
  • High output power>50mw.
  • SMF-28 Ultra fiber .
  • RoHS2.0 Compliant .
  • Compliant with Telcordia GR-468.
  • 14-pin butterfly package: (With TEC).

 

Absolute Maximum Ratings 

Table 1 - Absolute Maximum Ratings

ParameterSymbolMinMax.Unit
Operating Case TemperatureTc-2070
Storage TemperatureTstg-4085
Storage Relative HumidityHst-85%
Forward currentIop-500mA
Reverse voltageVr-2V
TEC CurrentITEC-1.2A
TEC VoltageVTEC-4V
Soldering Temperature-260℃/10S

 

          Optical Characteristics (T=25℃,unless otherwise noted)

ParameterSymbolTest     ConditionMinTyp.Max.Unit
Wavelength range λ -20~70℃154515501555nm
Threshold CurrentIthCW--35mA
Operating CurrentIopCW0-500mA
Forward VoltageVfCW--3V
Optical Output PowerPoCW,I=350mA50--mW
Slope EfficiencySECW,Iop-0.1- W/A
Side-mode Suppression RatioSMSRCW,Iop45--dB
LinewidthΔvCW,Iop--100kHz
Thermistor ResistanceRt25℃9.51010.5
Thermistor Sensitivity IndexBB25/50389039303970K
Optical IsolationISO-35--dB
Relative intensity noiseRINIop=500mA--151-dB/Hz
Fiber Bend Radius---0.9-mm

                   Others

ParameterDescriptions
Fiber typeSMF-28 Ultra
Fiber Length1000±100mm
ConnectorFC/APC
Packaged TypeButterfly block

 

Mechanical Design Diagram and Pin Definitions.The mechanical design and 

Connections diagram is shown in Figure 1. (Dimension inmm)

 

                  

Precautions 

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection. 

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended. 

b. Humidity in working environment should be controlled equal or above 40 percent RH. 

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc. 

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product. 

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