Y5010020022 1651nm DFB Laser Diode Butterfly Module Specification

所属分类： DFB

特点：1651nm 典型发射波长

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PN: Y5010020022

1651 nm DFB Laser Device Specification

Features

1651nm typical emission wavelength
Low phase noise
Excellent SMSR

Applications:

Fiber Sensing
Gas Detection for CH4
Test and measurement

Description:

The laser is a semiconductor InAlGaAs DFB laser working at the 1651nm wavelength range. This high performance, and high reliability laser is suitable for CWDM&RFOG applications. The SM fibers and PM fibers are optional.

Parameter：

Temp=25°C, I=200mA, beginning of life unless otherwise specified

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Condition
Threshold Current	Ith	50	60	75	mA
Current Range	CR	0	200	400	mA
Operating Voltage	Vop	1.2	1.7	2	V
Center Wavelength	λ	1650	1651	1652	nm
Optical Output Power	Pf	25	30	60	mW
Side-mode Suppression Ratio	SMSR	30	50	--	dB
Spectral Width (@-20dB)	Δλ	0.1	0.17	0.2	nm
Slope Efficiency	SE	0.15	0.2	0.3	w/A
Monitor Operating Current	Im	10	---	2000	uA
Thermistor Resistance	Rth	9.9	10	10.1	KΩ
Thermistor Sensitivity Index	β	3500	3950	4200	K
Wavelength stability	FWS	---	0.02	0.05	nm
Spectral Line Width	SLW	---	150	500	KHz

Mechanical Design Diagram and Pin Definitions.The mechanical design and Connections diagram is shown in Figure 1. (Dimension in mm)

No.	Function	No.	Function
1	Cooler Anode	8	NC
2	Thermistor	9	NC
3	MPD Anode	10	LD Anode
4	MPD Cathode	11	LD Cathode
5	Thermistor	12	NC
6	NC	13	Case Ground
7	NC	14	Cooler Cathode

Precautions

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection.

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended.

b. Humidity in working environment should be controlled equal or above 40 percent RH.

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc.

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product.

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