YB010010002 1064nm DFB Laser Diode Butterfly Module Specification

The 1064nm DFB Laser Diode Butterfly Module, with built-in TEC, thermistor, and MPD integrated in the 14PIN butterfly packaging. The hermetic design meets the requirements of telecommunication , with a narrow linewidth and high power,and at the same time support customer-specified pin definition customization.

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PN: YB010010002

1064nm DFB Laser Diode Butterfly Module Specification

Features

Wavelengths：1064nm

High reliability

Applications:

Metrology Seedlaser Spectroscopy

Description

Absolute Maximum Ratings

Table 1 - Absolute Maximum Ratings

Parameter	Symbol	Min.	Max
Storage Temperature	℃	-	85
Operation Temperature	℃	-	60
Optical output power (T=25℃)	mw	-	250
Laser reverse voltage(T=25℃)	V	-	2
Laser forward current(T=25℃)	mA	-	500

Optical & Electrical Characteristics
Parameter	Symbol		Min.		Typ		Max	Unit		Note
Threshold Current	Ith		20		25		30	mA		T=25℃
Output Optical Power	Po		20		36		-	mW		Iop=100mA,T=25℃
Slope Efficiency(Front facet)	η		0.5		0.9		-	W/A		T=25℃
Forward voltage	Vf		1.5		1.7		2	V		Iop=50mA,T=25℃
Wavelength Temperature Coefficient			-		0.08		-	nm/℃		Iop=100mA,T=15~30℃
Wavelength Current Coefficient			-		0.005		-	nm/mA		Iop=100~300mA,T=25℃
Peak Wavelength	λp		1062		1064		1066	nm		Iop=100mA，T=25℃
Side Mode Suppression Ratio	SMSR		35		-		-	dB		Iop=100mA,T=25℃
TEC Voltage			-		4		-	V
TEC Current			-		2.5		-	mA
Resistance value			-		10		-	KΩ		T=25℃
Fiber Characteristics
Parameter		Min.		Typ		Max			Unit		Note
Fiber type: SM CORNING HI1060
Fiber length (module case to ﬁber end)		1							m
Connector											FC/APC
Jacket				∅900					um

Precautions

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection.

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended.

b. Humidity in working environment should be controlled equal or above 40 percent RH.

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc.

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product.

Mechanical Design Diagram and Pin Definition. The mechanical design diagram is shown in Figure 1. (Dimension in mm)

PIN Definition

PIN	Description	PIN	Description
1	TEC+	8	NC
2	Thermistor	9	NC
3	Monitor anode(+)	10	Laser anode（+）
4	Monitor anode(-)	11	Laser anode（-）
5	Thermistor	12	NC
6	NC	13	Package ground
7	NC	14	TEC(-)