Y5010020023 1310nm SLD Laser Diode Butterfly (8pin HP) Module Specification

所属分类： SLD

特点：中心波长：1307~1313nm

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PN: Y5010020023

1310nm SLD Laser Diode Butterfly(8PIN LP) Module Specification

Features

Center wavelength：1307~1313nm.
Spontaneous emission light source，low ripple.
Low polarization extinction ratio.
Wide-spectrum light source,with a spectral width greater than 40 nm.
High reliability design.
RoHS Compliant.
Case operating temperature: -40~70℃ .
8-pin butterfly package: (With TEC).

Applications:

Fiber Optic Gyroscope
Optical Coherent Tomography（OCT）
Optical testing instruments
Optical fiber communication

Description:

The low polarization extinction ratio、low ripple and wide-spectrum of 1310nm SLD laser module is a SLD laser chip in 8-pin butterfly package with thermoelectirc cooler(TEC), thermistor inside.

Absolute Maximum Ratings

Table 1 - Absolute Maximum Ratings

Parameter	Symbol	Min.	Max
Storage Temperature	℃	-55	85
Case Operation Temperature	℃	-40	70
Laser reverse voltage(T=25℃)	V	-	2
Laser forward current(T=25℃)	mA	-	150
TEC current	A		1.2
TEC voltage	V		4

Optical & Electrical Characteristics
Parameter	Symbol	Min.	Typ	Max	Unit	Note
central wavelength	λ0	1307	1310	1313	nm	T=15℃~35℃,IF=120mA
spectral bandwidth	Δλ	40	-	-	nm	T=25℃,IF=120mA
Output Optical Power	Po	3	-	-	mW	T=25℃,IF=120mA
△P	△P	-	-	6	%	Tcase=-40℃~70℃，IF=120mA
polarization extinction ratio	PER	-	-	1.5	db	IF=120mA,T=25℃
spectral ripple	R	-	0.1	0.5	db	T=25℃,IF=120mA

Fiber Characteristics
Parameter	Min.	Typ	Max	Unit	Note
Fiber type: YOFC SM BI1012-A
Fiber length (module case to ﬁber end)	2			m
Connector					FC/APC
Jacket		∅900		um

Mechanical Design Diagram and Pin Definitions.The mechanical design and

Connections diagram is shown in Figure 1. (Dimension in mm)

8PIN SLD PIN definition

Precautions

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection.

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended.

b. Humidity in working environment should be controlled equal or above 40 percent RH.

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc.

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product.

关键词：Y5010020023 1310nm SLD Laser Diode Butterfly (8pin HP) Module Specification

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