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Y5010020005 1310nm SLD Laser Diode Butterfly (8pin HP) Module Specification

Y5010020005 1310nm SLD Laser Diode Butterfly (8pin HP) Module Specification

所属分类: SLD

特点:中心波长:1290~1330nm

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PN: Y5010020005

1310nm SLD Laser Diode Butterfly(8PIN HP) Module Specification

Features 

  

  •  Center wavelength1290~1330nm. 
  •  Spontaneous emission light sourcelow ripple.
  • High polarization extinction ratio.
  • Wide-spectrum light source,with a spectral width greater than 40 nm.
  • High reliability design.
  • RoHS Compliant.
  • Case Operating temperature: -40~70℃ .
  • 8-pin butterfly package: (With TEC).

 

Applications:

  • Optical Coherent TomographyOCT
  • Optical testing instruments
  • Optical fiber communication 

 

 

Description:

   The low polarization extinction ratiolow ripple and wide-spectrum of 1310nm SLD laser module is a SLD laser chip in 8-pin butterfly package with thermoelectirc cooler(TEC), thermistor inside.

 

 

 

Absolute Maximum Ratings 

Table 1 - Absolute Maximum Ratings

Parameter

Symbol

Min.

Max

Storage Temperature

-55

85

Case Operation Temperature 

-40

70

Laser reverse voltage(T=25℃)

V

-

2

Laser forward current(T=25℃)

mA

-

150

TEC current

A

 

1.2

TEC voltage

V

 

3.2

 

Optical & Electrical Characteristics

Parameter

Symbol

Min.

Typ

Max

Unit

Note

central wavelength

λ0

1290

-

1320

nm

T=25℃,IF=100mA

spectral bandwidth

Δλ

35

-

-

nm

T=25℃,IF=100mA

Output Optical Power

Po

1.5

-

-

mW

T=25℃,IF=100mA

△P

△P

-

-

6

%

Tcase=-40℃~70℃IF=100mA

polarization extinction ratio

PER

12

-

-

db

IF=100mA,T=25℃

spectral ripple

R

-

0.1

0.5

db

T=25℃,IF=100mA

 

Fiber Characteristics

Parameter

Min.

Typ

Max

Unit

Note

Fiber type: YOFC PM1016F

 

 

 

 

 

Fiber length (module case to fiber end)

2

 

 

m

 

Connector

 

 

 

 

FC/APC

Jacket

 

∅900

 

um

 

 

Mechanical Design Diagram and Pin Definitions.The mechanical design and Connections diagram is shown in Figure 1. (Dimension in mm)

Precautions 

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection. 

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended. 

b. Humidity in working environment should be controlled equal or above 40 percent RH. 

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc. 

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product. 

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