Y5010020004 1310nm SLD Laser Diode Butterfly (6pin HP) Module Specification

所属分类： SLD

特点：中心波长：1290~1330nm

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PN: Y5010020004

1310nm SLD Laser Diode Butterfly(6PIN HP) Module Specification

Features

Center wavlength：1290~1330nm.
Spontaneous emission light source，low ripple.
High polarization extinction ratio.
Wide-spectrum light source,with a spectral width greater than 40 nm.
High reliability design.
RoHS Compliant.
Case Operating temperature: -40~70℃ .
6-pin butterfly package: (With TEC).

Applications:

Optical Coherent Tomograpgy（OCT）
Optical testing instruments
Optical fiber communication

Description:

The low polarization extinction ratio、low ripple and wide-spectrum of 1310nm SLD laser module is a SLD laser chip in 6-pin butterfly package with thermoelectirc cooler(TEC), thermistor inside.

Absolute Maximum Ratings

Table 1 - Absolute Maximum Ratings

Parameter	Symbol	Min.	Max
Storage Temperature	℃	-55	85
Case Operation Temperature	℃	-40	70
Laser reverse voltage(T=25℃)	V	-	2
Laser forward current(T=25℃)	mA	-	150
TEC current	A		1
TEC voltage	V		3

Optical & Electrical Characteristics
Parameter	Symbol	Min.	Typ	Max	Unit	Note
central wavelength	λ0	1290	-	1320	nm	T=25℃,IF=100mA
spectral bandwidth	Δλ	35	-	-	nm	T=25℃,IF=100mA
Output Optical Power	Po	1.5	-	-	mW	T=25℃,IF=100mA
△P	△P	-	-	6	%	Tcase=-40℃~70℃，IF=100mA
polarization extinction ratio	PER	12		-	db	IF=100mA,T=25℃
spectral ripple	R	-	0.1	0.5	db	T=25℃,IF=100mA

Fiber Characteristics
Parameter	Min.	Typ	Max	Unit	Note
Fiber type: YOFC PM1016F
Fiber length (module case to ﬁber end)	2			m
Connector					FC/APC
Jacket		∅900		um

Mechanical Design Diagram and Pin Definitions.The mechanical design diagram is shown in Figure 1. (Dimension in mm)

PIN	1	2	3	4	5	6
Des.	SLED(+)	SLED(-)	Thermistor	Thermistor	TEC (-)	TEC (+)
Note: All pins are suspended from the casing.

Precautions

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection.

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended.

b. Humidity in working environment should be controlled equal or above 40 percent RH.

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc.

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product.

关键词：Y5010020004 1310nm SLD Laser Diode Butterfly (6pin HP) Module Specification

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