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友阳光电

友阳光电

友阳光电

友阳光电

友阳光电

友阳光电

友阳光电

友阳光电

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Y3050080001 50G COMBO OLT OSA SPECIFICATION

Y3050080001 50G COMBO OLT OSA SPECIFICATION

所属分类: 50G COMBO OLT

特点:三模三代(万兆50G/千兆10G/百兆2.5G)兼容

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PN: Y3050080001 

50G COMBO OLT OSA SPECIFICATION 

Description 

This single-fiber optical sub-assembly is designed for High-speed transmission and receiver applications.It is integrated with 50Gbs/s 1342nm EML、10Gb/s 1577nm EML and 2.5Gb/s 1490nm DFB Transmitter with TEC and NTC ,the other 50Gb/s 1286nm、10Gb/s 1270nm and 1.25Gb/s 1310nm Receiver with APD and TIA together with optical filters and isolator for beam direction.

Features  

⚫1342nm SOA EA electric absorption modulated cooled laser 

⚫1577nm SOA EA electric absorption modulated cooled laser and 1490nm DFB cooled laser

⚫ High sensitive APD -TIA of  50G/10G/1.25G 

⚫ -5~75℃ Operating temperature range 

⚫ LC connector 

⚫ Comply with ROHS requirements 

Application:  

⚫50G COMBO OLT

Absolute Maximum Ratings

ParameterSymbolMin.Max.UnitNote
Laser Diode Reverse VoltageVRL--1.7V 
Laser Diode Forward CurrentIFL--150mA 
SOA Forward CurrentIsoa--120mA 
SOA Reverse VoltageVrs---2V 
Modulator Reverse VoltageVmr---3V 
TEC Voltage----5.2V 
TEC Current----2.5A 
Operate TemperatureTOP-575 
Storage TemperatureTst-4085 

 

Optical and Electrical Characteristics of Transmitter and Recevier Characteristics( Tc=25℃,unless other specified)  

1342 EML Transmitter
ParameterSymbolMin.Typ.Max.UnitTest Condition
Nominal bit rateBR--50--Gb/s

CW, Iop=100mA,Isoa=100mA

 Vea=0V,

Top=45℃

Threshold CurrentIth----30mA
Optical powerPo7.0----mW
Forward VoltageVf----2V
Center wavelengthλp134013421344nm
Side Mode Suppression RatioSMSR35----nm
Spectral width△λ----0.4nm
Thermoelectric Cooler Power------1.1WCW, Tld=45°C
Thermoelectric Cooler Current------1.5ACW, Tld=45°C
Thermoelectric Cooler Voltage------2.8VCW, Tld=45°C
1577 EML Transmitter
ParameterSymbolMin.Typ.Max.UnitTest Condition
LD Forward VoltageVf----2.5VIop=100mA,Isoa=80mA; Vea=0V ,Top=45℃
Operation CurrentIop--100120mA
Output PowerPo6.5----mW
Thermoelectric Cooler Power------1.1WCW, Tld=45°C
Thermoelectric Cooler Current------1.5ACW, Tld=45°C
Thermoelectric Cooler Voltage------2.8VCW, Tld=45°C
1490 DML Transmitter
ParameterSymbolMin.Typ.Max.UnitTest Condition
Threshold CurrentIth--815mA--
LD Forward VoltageVf--1.11.6VIth+20mA
Output PowerPo1.55----mWIth+20mA
1286 Receiver
ParameterSymbolMin.Typ.Max.UnitTest Condition
Nominal bit rateBR--49.76--Gb/s--
Receiver wavelengthλp128412861288nm--
Supply CurrentIcc406075mAVcc=3.3V
Breakdown VoltageVbr10--40VId=100uA,Vcc off
Operating VoltageVop--Vbr*0.9--V--
Dark CurrentId----100nAVop,Pin=0uw,Tc=25℃
ResponsivityRes5----uA/uWVop,Pin=-30dBm,λ=1286nm,1284nm,1288nm
SensitivitySen-----25.7dBm

49.76 Gb/s, BER=10-2

, ER=6dB, Vop

Optical IsolateIOS30----dB@1270nm、1280nm、1292nm、1310nm
Optical crosstalkCT 45----dB1490nm,1577nm,1342nm
1270 Receiver
ParameterSymbolMin.Typ.Max.UnitTest Condition
Supply CurrentIcc30 60mAVcc=3.3V
Breakdown VoltageVbr35 60VId=10uA
Operating VoltageVop--Vbr-3--V--
Dark CurrentId----100nAVop,Pin=0uw,Tc=25℃
ResponsivityRes8----uA/uWVop,Pin=-30dBm,λ=1270nm,1280nm
SensitivitySen-----32dBm10Gb/s, NRZ,BER=10-3,ER=6dB,PRBS31,Vop
Optical IsolateIOS30----dB@1284nm,1286nm,1288nm,1292nm,1310nm
Optical crosstalkCT 45----dB1490nm,1577nm,1342nm
1310 Receiver
ParameterSymbolMin.Typ.Max.UnitTest Condition
Supply CurrentIcc30 60mAVcc=3.3V
Breakdown VoltageVbr35 60VId=10uA
Operating VoltageVop--Vbr-3--V--
Dark CurrentId----100nAVop,Pin=0uw,Tc=25℃
ResponsivityRes8----uA/uWVop,Pin=-30dBm,λ=1310nm
SensitivitySen-----37dBm1.25Gb/s, NRZ,BER=10-12,ER=10dB,PRBS23,Vop
Optical IsolateIOS30----dB@1270nm、1280nm、1284nm、1286nm、1288nm
Optical crosstalkCT 45----dB1490nm,1577nm,1342nm

 

.Mechanical Design Diagram and Pin Definitions(Dimension in mm)

 

Precautions 

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection. 

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended. 

b. Humidity in working environment should be controlled equal or above 40 percent RH. 

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc. 

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product. 

 

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Y3050080001 50G COMBO OLT OSA SPECIFICATION

特点:三模三代(万兆50G/千兆10G/百兆2.5G)兼容

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